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Topic: Cooling
Product: Spire Coolwave II (SP503B0)
Supplied By: Spire
Date: 01/10/05
Reviewer: TPalmer
 

Introduction

When Intel introduced the LGA 775 platform I wonder if they knew how long it would take heatsink manufactures to commit to making heatsinks that would work on this new platform. I can't remember an introduction of a new platform that was met with a more lukewarm reception than that the LGA 775. This cold shoulder was not only given to it by the parts builders but by the people that should be buying them as well. For the buyers it was all about speed, Intel hadn't proven that the LGA 775 with DDR2 memory could out perform the same Pentium 4 Northwood based system. With the hardware maker it is probably money, where they have to tool up to start product of a new line of heatsinks that may or may not sell.

But either way you look at it something needed to be done since the plain Jane heatsink Intel provided was nothing short of a stop-gap means to cool your processor. Yeah I have heard about people overclocking their machine using the Stock cooler just like you have but they probably had a half a dozen case fan going to.

So today we are going to check out Spire's entry into the LGA 775 cooling craze and see how they stack up against the rest of the ones we have been testing lately. So after a few words about the company we will get started.

About Spire

Founded in 1991, Spire® is the premier brand for computer thermal solutions. In order to meet the needs of the global market, we have established the production facilities in China, our corporate office in the USA and overseas branches in The Netherlands, U.K., Germany, France, Taiwan, Japan and Brazil. All are strategically located to better work with the customers we serve.

The purpose built Spire factory and all of the products were approved by CE, UR, CSA, and TUV in 1998. We have gained AMD and VIA approvals along with recognition by International Standard Commission for Quality Assurance in 1999 against ISO-9002 and ISO-9001. (No.Q16437)

With today’s high-speed processors functioning at an unprecedented speed and output, the demand for better and more reliable cooling solutions has become one of the most important issues in the computer industry today. As a premier manufacturer of high quality cooling solutions, we are able to meet the demands of the computer industry by providing competitively priced products, next day delivery and lifetime warranty.


The reliability of our products has earned the loyalty of many well known manufacturers and distributors throughout the world and we have maintained close business ties with international names in the computer industry.

At Spire we continually strive to improve and develop a wide range of thermal products by investing heavily in our quality manufacturing process and Research & Development. Our objective is to provide top quality products for national distributors as well as for ODM and OEM clients. We are always moving forward with new and innovative thermal solutions.

This year we are continuing the ongoing enhancements of our current production machinery as well as purchasing new equipment in an effort to provide an ever improving product line. One of our latest machines enables us to balance our fan blades with a greater degree of accuracy. By balancing the blades more efficiently, we are able to extend the life of the bearing and reduce the overall noise of the fan. This technique also allows us to increase the speed of fans without increasing the noise.

Our focus is to build on the current success of the Spire brand so that our brand is recognized world wide as a provider of top quality cooling solutions. We will continue to work to maintain the satisfaction of our customers and share the knowledge of our experts to provide our customer's with 'The perfect cooling solution'.

Features

  • All new UV reactive patented 90mm Spider-Fan design
     

  • Temperature controlled for more efficient cooling
     

  • Omni directional heat-sink design with large copper core
     

  • Supports all new P4 Prescott LGA-775 micro-processors

Copper BaseFan GuardLow Temperature SolutionRetail Box

Spire Coolwave 2 (SP503B0)


Specifications

Socket 775 Cooling kit
Dimensions
Heat sink :        90×90×32 mm (l × w × h)
12VDC Fan : 90×90×25 mm
Bearing Ball bearing
Rated speed 2500 ~ 3500 RPM +/-10%
Rated power 2.4 ~ 4.8 W
Noise level 35 ~ 45 dBA
Air flow 41.15 ~ 58.21
Current 0.2 ~ 0.40 A
Life hours Ball: 50.000
Features Copper core, Radial fin design
Connector 4 pin w/ PWM function (3 pin MB compatible)
Application
Intel :   Pentium 4 ~ 3.8 GHz (LGA-775 Prescott)
Thermal resistance @ 3400 RPM 0.299 °C/W
Thermal type Stars-420 white grease (Injection tube)

 

 

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